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      MILESTONE
       
      2019
      Established Project
      2020
      Project Completion
      2021
      Putting into production
      2022
      Striding development
      2019
      July

      LVG Semiconductor (Huangshi) Co., Ltd was offically established in Huangshi on July 24th,2019.

      Sept.

      In August 2019, the industry project of LVG wafer reclaim that is important investment project imported by local government was settled down to Huangshi Tieshan Distric, was listed in the key construction project of Hubei province.

      Nov.

      The foundation laying ceremony of the project was held in Huangshi Tieshan District.Dong Weimin,secretary of Huangshi Municipal Party Committee, attended the ceremony, Wu Zhiling, Member of the Standing Committee of the Municipal Party Committee, Secretary of the Party Working Committee of the Development Zone and Secretary of the Tieshan District Party Committee, and Huang Jingguo, Member of the Standing Committee of the Municipal Party Committee and Secretary General of the Municipal Party Committee, attended the ceremony.

      2020
      July

      Wafer Reclaim Project Phase I began loading and construction

      Nov.

      General Manager Oliver Tsai presided over the topping-out ceremony of the first phase of the project, and Chairman Charles Kau delivered a speech.Dong Weimin, Secretary of Huangshi Municipal Party Committee, Wu Jin, Deputy Secretary of Huangshi Municipal Party Committee and Mayor, Wang Yibo, Executive President of Eleven Technologies, Yang Liangsheng, General Manager of CEC II, Xia Feng, Senior Vice General Manager, Zhang Weiqiang, Vice General Manager, Wu Xegang, General Manager of Shanghai Head Office, Wei Ziqing, General Manager of Construction General Contractor II, and Hu Yunyun, General Manager of Wuhan Company attended this ceremony.

      LVG Semiconductor (Huangshi) Co., Ltd officially changed its name to Xtek semiconductor (Huangshi)co.ltd

      2021
      Mar.

      Two wet process equipment entered the clean room in the core area of the plant successfully. and with the first batch of equipment moving in, the project officially entered the equipment installation and commissioning stage.

      Apr.

      The company held a wafer casting ceremony for the first phase of the reclaim wafer project in the development zone of Huangshi City, Hubei Province, with the theme of "Gathering wisdom of 'crystal' to cast brilliant 'chip'".Mayor Wu Jin, Party Committee of the Municipal Party Committee, Secretary of the Party Working Committee of the Development Zone, Secretary of the Tieshan District Committee Wu Zhiling, Director of the Taiwan Affairs Office Cheng Deqian and other supporting manufacturers such as Taiwan Sun Pulse Trading Co. were present to witness the film casting ceremony together with the company's shareholders, guests, partners and friends on site. The ceremony began with the general manager of the company, Cai Siong Yuan, presiding over the event. Li Nan, chairman of CLP II, and Wang Yibo, executive president of the Eleventh Institute of Electronics, delivered speeches respectively. After the ceremony, the city leaders visited the production line of the factory.

      Jun.

      The company has successfully passed the ISO 9001:2015 quality management system certification and obtained relevant certificates.

      Aug.

      The company joined the Hubei Semiconductor Industry Association and became a member.

      Sept.

      The Company was shortlisted by the Hubei Provincial Listing Office as one of the new "Golden Seed" companies to be listed in 2021. Jingxin produced 5,000 recycled wafers and shipped them to chip makers from Huangshi, becoming the first 12-inch recycled wafer supplier in mainland China.

      2022
      Jan.

      The company obtained the ISO 14001:2015 environmental management system certificate, taking this opportunity to take a big step forward towards standardised and regulated management of the company.

      May

      The commencement ceremony of the second phase of the 12 inch wafer recycling project was held in the company.The groundbreaking ceremony for the second phase of the 12-inch wafer regeneration project was held at the company.

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